• Product and Test Engineering team (PTE), which has full ownership of IGBT, IC's and Multi-Chip Module (MCM) products as they are released to manufacturing at OSAT/ Subcons and assembly sites.
  
• Main responsibilities include yield enhancement by working with Fabs and assembly sites, Lots on Hold (LOH) disposition, quality and test improvement, customer FAR support and cost reduction projects at FE and BE in operations.
  
• Responsibilities include product characterization, testability and manufacturability study (DFT and DFM) during the NPI process and release to production.
  
• Responsible for data collection, analysis and feeding back to the design and manufacturing teams, recommendations and product learning in order to systematically improve product processes, technologies and product lines for yields, quality and cost down plans
  

Requirements

• 日本語語学力（ネイティブレベルのコミュニケーション力必須） Native Japanese Speaker with excellent communication skill.
  
• 英語語学力（TOEIC800以上) / Business English skill (Email/Reading Manual/Conversation/Phone conversation/Teleconference, Biz Negotiation).
  
• More than 8 years’ experience of IC product engineering.
  
• Knowledge of test and semiconductor manufacturing operation.

• More than 8-year experience working with Power devices (IGBT, IC, MCM etc.) related to Fab and Assembly manufacturing, test, yield enhancement, quality and reliability and cost reduction areas.
  
• Knowledge and experience in Statistical and Problem-Solving Methodologies.
  
• Knowledgeable in all electrical characteristics of Power MOSFETs, IC's, IGBT, IC and MCM products.
  

Benefits

• Base Salary
  
• Bonus based Company and Individual Performance
  
• Standard Health and Pension benefits.
  
• 401K